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Die-Attach Force Measurement

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Fragile semiconductor chips require careful handling before packaging. During chip attachment processes using TSV (Through-Silicon Via), eutectic, epoxy or solder, a constant force must be applied to the chip. Incorrect application of force leads to chip breakage and incomplete bonding. Load cells built into the chip attachment tool provide closed-loop control during this delicate process.

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How it works :

  1. A miniature LCM100 series load cell is used to measure the soldering force of a chip to its PCB.
  2. As the armature presses the chip down onto the board, the LCM100 sensor measures the applied force.
  3. The applied force is then displayed on the IHH500 or IPM650 digital display.
  4. The use of an analog amplifier IAA300 or the analog output from the IPM650 or IDA100, allows to send the signal to a PLC and thus to automate and control the welding process.
  5. The signal-to-noise ratio of the IAA300 output makes it ideal for high precision motion control.

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